Jipelec (RTA) Rapid Thermal Processing & Annealing

 

RTA

 

Housed in a bench top frame, the system includes:

  • A cold-wall reaction chamber for wafers up to 8" and/or square cells up to 156 x156 mm² and a powerful multi-zone infrared lamp furnace 
  • PIMS software control allows full process monitoring, data acquisition and pyrometer calibration for a variety of substrates
  • Substrate temperature can be measured with up to (3) thermocouples at different locations or with a pyrometer for high temperature processes
    • High heat rates with temperatures up to 1300°C
    • Process under vacuum possible
    • Up to (2) different process gases available in addition to N2 purge
    • Programmable automated processing 

 

Contact Sergi Lendinez for more information

 

LSU